3D Automatic Optical Inspection

| Environmental Testing

Modular automatic optical inspection system is adaptable for use in customised electronics

Mek is producing a modular full 3D AOI (Automatic Optical Inspection) system for THT solder joints and THT components.

SpectorBOX X1 takes a different approach to Through-Hole Technology (THT) inspection and can be used bottom-up for volume measurement of THT solder joints and pin height measurement, or Top-Down for a large 150mm + clearance for 3D THT components measurement – making it the first compact 3D AOI system that is capable of inspecting THT solder joints and components with the required precision for modern electronics manufacturing.

The SpectorBOX X device delivers direct volumetric measurements of solder joints from Selective, Wave, Robotic, Pin-in-Paste Reflow, Laser and Manual soldering systems in addition to accurate pin height measurement. This compact 3D modular AOI system offers an impressive high clearance of 150mm (5.9″) and beyond on the THT components side and over 100mm (3.9″) on the THT solder side to accommodate most conveyor designs. The X, Y and Z-axis moving optics ensure inspection of most pallet designs.

With effective shadow and high reflection suppression, along with high repeatability rates in 3D volumetric measurements, the SpectorBOX X1 meets the required quality control standards at a reasonable price. Its compact design, separate control box, and I/O options make it easy to integrate into existing conveyor systems.

In THT assembly lines, where custom-built handling systems for dedicated products are the norm, standard SMT AOI machines fall short due to size, weight, clearance and environmental conditions. Mek’s modular SpectorBOX platform offers a customisable product, making it adaptable to the unique production environment. Many integrators have already successfully incorporated Mek’s modular AOI into complex THT production lines.

Jonathan Newell
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