Software enables fully automated process sequencing for high volume advanced 3D semiconductor packaging
Optomec has added production control software to its 3D printing equipment designed specifically for high volume manufacturing of printed electronics. The “KEWB” software was designed for Optomec’s high volume production customers with applications such as multi-chip packaging, mm-wave interconnects, heterogenous chip integration and 3D printed antennas for 5G devices.
KEWB incorporates enhanced operator guidance, powerful vision and alignment tools, extended runtime process control and industry 4.0 connectivity to meet the demands of modern manufacturers. Additionally, KEWB includes a powerful scripting capability that enables automated sequencing of all critical process steps for continuous inline production; ie: load, scan, align, print, inspect, unload, etc.
The release of the KEWB software follows the recent introduction of the Aerosol Jet HD2 printer, which combines high-speed, sub-micron resolution, SEMI-compliant inline conveying and advanced alignment optics over a 300 x 300 mm work area.
“The new KEWB software simplifies everything — from process integration to operation sequencing to maintenance.” said Dave Gleason, Software Development Manager at Optomec. “In addition, it’s configurable for multiple user levels, so the engineer sees a full vision tool kit while the machine operator sees a simplified, pictorial sequence of process steps.”
Optomec’s Printed Electronics machines enable manufacturers to create extremely fine 3D electronic structures–such as circuits, sensors, antennas and interconnects–with features as small as 10 microns using nanoparticle inks. The machines are widely used in the Aerospace and Defence, Energy, Medical Device, Advanced Electronics Packaging and Research segments.