Siemens’ Embeddable BCI-ROM technology enables accurate thermal models of IC packages to be shared for 3D CFD thermal analysis
Jonathan Newell is a graduate of Loughborough University and has three decades of experience in engineering as well as broadcast and technical journalism.
Latest posts by Jonathan Newell (see all)
- UK manufacturing steps up to COVID-19 crisis - April 2, 2020
- Clustering Innovation - March 12, 2020
- A Global Monitor - March 6, 2020