Sensor for semiconductor tool set-up

| Information and Communication Technology

WaferSense Auto Resistance Sensor measures contact resistance during plating

CyberOptics has been demonstrating its WaferSense Auto Resistance Sensor (ARS) with CyberSpectrum software.

The 300mm Auto Resistance Sensor (ARS) with CyberSpectrum software enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications. The ARS quickly identifies and monitors resistance measurements with 50 separate pads around the perimeter using a Kelvin Sensing (4-wire resistance) method to detect residue affecting plating pins.

Process and equipment engineers in semiconductor fabs can predict when a tool needs maintenance with quantitative analysis of measured mean resistance over time, shorten equipment maintenance cycles and improve cell-to-cell uniformity with the wafer-like, 4-wire resistance sensor and CyberSpectrum software’s objective and repeatable data.

According to Dr Subodh Kulkarni of CyberOptics, the ARS can wirelessly capture and monitor real-time resistance measurements for the Electrochemical Deposition application in semiconductor fabs, saving time, expense as well as improving processes.

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