Designed for a range of applications from hand-held to large storage and computing devices, Molex rigid flex circuits and assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a reliable single power and signal system with lower total applied cost. The hybrid constructions consist of rigid and flexible substrates laminated together into a single structure that integrates the features of a PCB with the advantages of flexible printed circuit technology.
Supporting larger connector housings and an array of surface-mounted electronic components, the flexible circuitry allows the assembly to be bent or folded into a three-dimensional package. Molex flex circuitry can be built with 20 or more layers, depending on the specific design requirements. Rigid flex circuits can have components surface mounted on one or both sides, which increases the overall circuit density and provides additional packaging options. Unbonded layers provide maximum flexibility for tight spaces.
Molex flex circuits and assemblies are available in a range of material stack-up and design layout options to meet stringent military application requirements. Here, the flexible substrate integrates power and signal technologies into one package to reduce weight and optimize packaging. Assemblies featuring rigid flex circuitry can be press-fit, wave soldered or surface mounted.
“Rigid flex assemblies allow a unified approach to solve electronic power, signal distribution, and packaging problems when standard rigid boards or cables are not feasible. They can also help eliminate the need for separate boards, connectors and cables,” states Dan Dawiedczyk, director of marketing, Molex. “They provide lower applied-cost for high-end mission-critical power and signal distribution designs.”